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Modelling of Adhesive Bonding
Author(s) -
Koschecknick Kai
Publication year - 2018
Publication title -
ce/papers
Language(s) - English
Resource type - Journals
ISSN - 2509-7075
DOI - 10.1002/cepa.944
Subject(s) - adhesive , process (computing) , adhesive bonding , materials science , computer science , mechanical engineering , bond , process engineering , composite material , manufacturing engineering , engineering , business , programming language , finance , layer (electronics)
A realistic material model of adhesives is essential for a verification concept for structural adhesive bonds. With the increasing accuracy of the simulation results of a meaningful FE model, it is possible to avoid excessively high safety factors and bonded supporting structures can be measured economically. A comprehensive adhesive model, which was created taking into account experimentally determined material characteristics, makes an important contribution in bringing together research and industry in the development of an innovative joining process.