Premium
Linking the Cu(II/I) and the Ni(IV/II) Potentials to Subsequent Passive Film Breakdown for a Cu−Ni Alloy in Aqueous 0.5 M NaCl
Author(s) -
Langley Amelia R.,
Elmer Aisling,
Fletcher Philip J.,
Marken Frank
Publication year - 2020
Publication title -
chemelectrochem
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 59
ISSN - 2196-0216
DOI - 10.1002/celc.201901927
Subject(s) - copper , passivation , alloy , chronoamperometry , nickel , materials science , cyclic voltammetry , metal , metallurgy , conductor , aqueous solution , analytical chemistry (journal) , transition metal , inorganic chemistry , electrochemistry , chemistry , electrode , composite material , layer (electronics) , biochemistry , chromatography , catalysis
Copper and copper–nickel alloys are known to form partially passive films in marine conditions, both naturally and under positive potential bias. Here, the anodic passivation behaviour of copper and of constantan (Cu 54 Ni 45 Mn 1 ) as a model for a copper‐nickel alloy are investigated and compared at high positive overpotentials and in 0.5 M NaCl(aq). Abrupt potential‐dependent passive film breakdown is observed for both Cu and Cu−Ni alloys during voltammetry and during chronoamperometry experiments. For Cu, a single transitions occurs at 0.2 V vs. SCE consistent with a Cu(II/I) process, leading to interfacial stress and breaking of a passive CuCl film. For Cu−Ni alloy, two stages are observed at 0.3 V vs. SCE due to a Cu(II/I) process and at 1.7 V vs. SCE due to a sub‐interfacial Ni(IV/II) process. A breakdown mechanism is proposed based on redox processes at the buried interface at the metallic conductor | passive ion conductor junction.