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Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties
Author(s) -
Hai Nguyen Thi Minh,
Broekmann Peter
Publication year - 2015
Publication title -
chemelectrochem
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 59
ISSN - 2196-0216
DOI - 10.1002/celc.201500104
Subject(s) - copper interconnect , materials science , polymer , electroplating , epichlorohydrin , chemical engineering , composite material , metallurgy , copper , layer (electronics) , engineering
A successful bottom‐up fill of single Damascene test features is achieved by using a two‐component additive package consisting of bis ‐(sodium‐sulfopropyl)‐disulfide (SPS) and Imep polymers (polymerizates of imidazole and epichlorohydrin). In addition, a remarkable leveling effect is observed. Clearly, the Imep additive combines bottom‐up fill capabilities with leveling characteristics in one single polymer component. These unique hybrid properties of the Imep are rationalized on the basis of an extended N‐NDR (N‐shaped negative differential resistance) being present in the linear‐sweep voltammogram of the SPS/Imep additive system during Cu electrodeposition.