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Metal–Organic Frameworks: New Interlayer Dielectric Materials
Author(s) -
Usman Muhammad,
Mendiratta Shruti,
Lu KuangLieh
Publication year - 2015
Publication title -
chemelectrochem
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 59
ISSN - 2196-0216
DOI - 10.1002/celc.201402456
Subject(s) - dielectric , microelectronics , materials science , metal organic framework , leakage (economics) , porosity , nanotechnology , high κ dielectric , optoelectronics , engineering physics , electronic engineering , composite material , engineering , chemistry , organic chemistry , adsorption , economics , macroeconomics
Some metal–organic frameworks (MOFs) with low dielectric constants, high thermal/mechanical stabilities, low leakage currents, and good comparability in devices can lead to integrated circuits, in which the MOF can act as an interlayer dielectric (ILD) material with tunable structural properties and high porosity. Based on initial research, in this Highlight, we propose a roadmap that can serve as a starting point for addressing the potential use of MOFs as ILD materials in the microelectronics industry, providing an effective path towards achieving remarkable new applications of dielectric MOFs in the future.