Premium
Characterization of Slurries Used for Chemical‐Mechanical Polishing (CMP) in the Semiconductor Industry
Author(s) -
Kuntzsch T.,
Witnik U.,
Hollatz M.,
Stintz M.,
Ripperger S.
Publication year - 2003
Publication title -
chemical engineering and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.403
H-Index - 81
eISSN - 1521-4125
pISSN - 0930-7516
DOI - 10.1002/ceat.200303050
Subject(s) - chemical mechanical planarization , slurry , polishing , characterization (materials science) , agglomerate , materials science , semiconductor industry , particle (ecology) , semiconductor , particle size , abrasive , metallurgy , chemical engineering , nanotechnology , composite material , engineering , optoelectronics , manufacturing engineering , oceanography , geology
In the chemical‐mechanical polishing applied during the manufacture of semiconductor devices the polishing slurry is of major importance for the processing result and hence, a permanent, strict monitoring of the slurry properties is necessary. For this purpose qualified particle size analysis methods for the characterization of the solid particles used in the CMP slurries are required. Additionally, small amounts of agglomerates and large particles have to be detected.