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Object‐oriented heat transfer software application
Author(s) -
Tan F. L.,
Chua Patrick S. K.
Publication year - 2005
Publication title -
computer applications in engineering education
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.478
H-Index - 29
eISSN - 1099-0542
pISSN - 1061-3773
DOI - 10.1002/cae.20059
Subject(s) - heat transfer , thermal conduction , solver , convective heat transfer , mechanics , heat flux , cylinder , computer science , mechanical engineering , heat transfer coefficient , materials science , thermodynamics , physics , engineering , programming language
A heat transfer solver has been developed using an object‐oriented approach, which allows the heat transfer problem to be set up and solved easily with ease and user‐friendliness. The solver is developed as a Window application using Java programming. It can solve several types of heat transfer problems such as one‐dimensional steady‐state heat conduction through a plane wall, cylinder, or sphere, with temperature, heat flux, and convective boundary conditions (BCs), one‐dimensional transient heat conduction through a plane wall, lumped system analysis, extended heat transfer surface, forced convection over a flat plate, and radiation. © 2005 Wiley Periodicals, Inc. Comput Appl Eng Educ 13: 333–346, 2005; Published online in Wiley InterScience (www.interscience.wiley.com); DOI 10.1002/cae.20059