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Uniform Surface Characteristics in Sequentially Polymerized Polyurea Films
Author(s) -
Choi UiJin,
Kim Hyein,
Park YiSeul,
Lee Jin Seok
Publication year - 2018
Publication title -
bulletin of the korean chemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.237
H-Index - 59
ISSN - 1229-5949
DOI - 10.1002/bkcs.11344
Subject(s) - polyurea , materials science , wafer , polymer , surface roughness , thin film , surface finish , root mean square , composite material , layer (electronics) , nanotechnology , analytical chemistry (journal) , chemical engineering , chemistry , coating , organic chemistry , engineering , electrical engineering
We successfully fabricated uniformly aligned polyurea thin films using molecular layer deposition (MLD) technique. By measuring the film thickness as a functional of the number of cycles, we confirmed the linear growth behavior of the polyurea MLD film. We also fabricated a spin‐coated polyurea films after synthesis of the polyurea polymer in solution, and compared their roughness and surface potential with the prepared MLD film. The polyurea MLD film had a low root‐mean square value and homogeneous surface potentials, whereas the spin‐coated film had very rough surface and a highly variable surface potential. We believe that our results will contribute to performance improvement of polymer‐based electrical devices and provide greater insight into the fabrication of uniformly aligned polymer thin films.