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Development of an Ibuprofen‐releasing biodegradable PLA/PGA electrospun scaffold for tissue regeneration
Author(s) -
Cantón Irene,
Mckean Robert,
Charnley Mirren,
Blackwood Keith A.,
Fiorica Calogero,
Ryan Anthony J.,
MacNeil Sheila
Publication year - 2009
Publication title -
biotechnology and bioengineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.136
H-Index - 189
eISSN - 1097-0290
pISSN - 0006-3592
DOI - 10.1002/bit.22530
Subject(s) - ibuprofen , scaffold , regeneration (biology) , chemistry , electrospinning , nanofiber , biomedical engineering , polymer , pharmacology , materials science , nanotechnology , microbiology and biotechnology , medicine , organic chemistry , biology
Our aim was to develop a biodegradable fibrous dressing to act as a tissue guide for in situ wound repair while releasing Ibuprofen to reduce inflammation in wounds and reduce pain for patients on dressing changes. Dissolving the acid form of Ibuprofen (from 1% to 10% by weight) in the same solvent as 75% polylactide, 25% polyglycolide (PLGA) polymers gave uniformly loaded electrospun fibers which gave rapid release of drug within the first 8 h and then slower release over several days. Scaffolds with 10% Ibuprofen degraded within 6 days. The Ibuprofen released from these scaffolds significantly reduced the response of fibroblasts to major pro‐inflammatory stimulators. Fibroblast attachment and proliferation on scaffolds was unaffected by the addition of 1–5% Ibuprofen. Scaffolds loaded with 10% Ibuprofen initially showed reduced cell attachment but this was restored by soaking scaffolds in media for 24 h. In summary, addition of Ibuprofen to electrospun biodegradable scaffolds can give acute protection of adjacent cells to inflammation while the scaffolds provide an open 3D fibrous network to which cells can attach and migrate. By 6 days, such scaffolds will have completely dissolved into the wound bed obviating any need for dressing removal. Biotechnol. Bioeng. 2010; 105: 396–408. © 2009 Wiley Periodicals, Inc.