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Back Cover: Layer‐by‐Layer‐Based Silica Encapsulation of Individual Yeast with Thickness Control (Chem. Asian J. 1/2015)
Author(s) -
Lee Hojae,
Hong Daewha,
Choi Ji Yu,
Kim Ji Yup,
Lee Sang Hee,
Kim Ho Min,
Yang Sung Ho,
Choi Insung S.
Publication year - 2015
Publication title -
chemistry – an asian journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.18
H-Index - 106
eISSN - 1861-471X
pISSN - 1861-4728
DOI - 10.1002/asia.201490051
Subject(s) - yeast , encapsulation (networking) , saccharomyces cerevisiae , atomic layer deposition , layer by layer , materials science , nanotechnology , chemistry , layer (electronics) , chemical engineering , computer science , biochemistry , engineering , computer network
Encapsulation Single‐cell encapsulation holds great potential for cell‐based sensors, cell therapy, tissue engineering, as well as single‐cell biology. In their Communication on page 129 ff., Insung S. Choi et al. utilize a layer‐by‐layer cycle deposition of poly(diallyldimethylammonium chloride) and in situ silicification to encapsulate Saccharomyces cerevisiae individually in silica with control of shell thickness. On the Back Cover image, taken by Youngran Youn and Hoseung Lee, each onion ring represents the shell formed by one cycle of deposition and silicification.