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Layer‐by‐Layer‐Based Silica Encapsulation of Individual Yeast with Thickness Control
Author(s) -
Lee Hojae,
Hong Daewha,
Choi Ji Yu,
Kim Ji Yup,
Lee Sang Hee,
Kim Ho Min,
Yang Sung Ho,
Choi Insung S.
Publication year - 2015
Publication title -
chemistry – an asian journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.18
H-Index - 106
eISSN - 1861-471X
pISSN - 1861-4728
DOI - 10.1002/asia.201402993
Subject(s) - materials science , layer by layer , saccharomyces cerevisiae , nanomaterials , layer (electronics) , porosity , yeast , nanotechnology , composite material , elasticity (physics) , durability , stiffness , polymer , chemical engineering , chemistry , biochemistry , engineering
In the area of cell‐surface engineering with nanomaterials, the metabolic and functional activities of the encapsulated cells are manipulated and controlled by various parameters of the artificial shells that encase the cells, such as stiffness and elasticity, thickness, and porosity. The mechanical durability and physicochemical stability of inorganic shells prove superior to layer‐by‐layer‐based organic shells with regard to cytoprotection, but it has been difficult to vary the parameters of inorganic shells including their thickness. In this work, we combine the layer‐by‐layer technique with a process of bioinspired silicification to control the thickness of the silica shells that encapsulate yeast Saccharomyces cerevisiae cells individually, and investigate the thickness‐dependent microbial growth.