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Highly flexible and thermal conductive films of graphene/poly(naphthylamine) and applications in thermal management of LED devices
Author(s) -
Qiu Hanxun,
Zhao Xiaowei,
Li Haoliang,
Li Ying,
Li Jing,
Yang Junhe
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.51383
Subject(s) - graphene , materials science , thermal conductivity , miniaturization , thermal management of electronic devices and systems , oxide , electronics , nanotechnology , electrical conductor , thermal , composite material , optoelectronics , mechanical engineering , electrical engineering , engineering , metallurgy , physics , meteorology
In 5G era, integration and miniaturization of electronic components lead to increasing challenges in thermal management. Materials with high thermal conductivity and flexibility are strongly desired for dissipating heat locally generated in such devices. Due to its extraordinary thermal conducting performance, graphene has been exhibiting great potential in thermal management. In this work, composite films based on graphene oxide and poly‐naphthylamine (gGO/PNA) with enhanced thermal conducting performance have been achieved by employing poly (naphthylamine) (PNA) as repairing additives to restore topological defects of graphene oxide (GO). Specifically, gGO/PNA films are prepared with a facile operation of vacuum filtration followed by an elevated temperature treatment. The optimal thermal conductivity (κ) of gGO/PNA reaches to 1016.03 W m −1 K −1 , 31.3% enhancement over that of the pristine graphene one. The thermal conducting performance test demonstrates the film an efficient heat‐dissipation ability from a heat‐generating LED bulb. Furthermore, the film exhibits excellent flexibility, making it survival from a 1000‐cycle bending test. This finding may promote the development of heat‐spreading materials and their applications in thermal management of highly integrated electronics.