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Spherical hybrid filler BN @ Al 2 O 3 via chemical adhesive for enhancing thermal conductivity and processability of silicon rubber
Author(s) -
Guan Shengwen,
Su Ziru,
Chen Feng,
Fu Qiang
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.51211
Subject(s) - materials science , composite material , thermal conductivity , thermal diffusivity , polydimethylsiloxane , adhesive , viscosity , microstructure , boron nitride , rheology , physics , layer (electronics) , quantum mechanics
Hexagonal boron nitride (h‐BN) is an ideal candidate material for electrical and electronic systems due to its excellent performance. However, the addition of platelet‐like h‐BN leads to a dramatic increase of viscosity of composites and anisotropic thermal conductivity of composites. Herein, modified h‐BN (m‐BN) was coated onto spherical α‐Al 2 O 3 via chemical adhesive, and core‐shell structured hybrid spherical filler (m‐BN@Al 2 O 3 ) was prepared. Furthermore, the microstructure, rheology, mechanical properties, and thermal conductivity of hybrid filler/polydimethylsiloxane (PDMS) were studied. At 60 vol% filler loading, the thermal conductivity of m‐BN@Al 2 O 3 /PDMS is up to 2.23 W·m −1 ·K −1 , which is 86% higher than that of Al 2 O 3 /PDMS and the ratio of in‐plane diffusivity to through‐plane diffusivity decreases from 2.0 to 1.0. At meanwhile, the viscosity of m‐BN@Al 2 O 3 /PDMS is about one fourth of the viscosity of m‐BN/Al 2 O 3 /PDMS. This simple and versatile strategy opens a pavement for enhancing the thermal conductivity of polymer and has great potential in high‐frequency communication.