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In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites
Author(s) -
Tran Thi Tuong Vi,
Vo DaiViet N.,
Nguyen Son Thanh,
Luu Son D. N.,
Mofijur M.,
Vu Canh Minh
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.51193
Subject(s) - epoxy , materials science , composite material , nanocomposite , composite number , thermal conductivity , electromagnetic shielding
This study presents a 3‐dimensional (3D) network structure of cellulose scaffold (CS), which was in situ decorated with silver nanoparticles (AgNPs). The scaffold was then infiltrated with epoxy matrix and cured at elevated temperature to sinter the AgNPs; finally, highly thermoconductive epoxy composites (Ag@CS/epoxy) was obtained. The resultant Ag@CS20/epoxy composite reached a thermal conductivity of 2.52 W·m −1 ·K −1 at 2.2 vol% of filler loading, which shows an enhancement of over 11‐folds in the thermal conductivity compared to the neat epoxy. The superb electrical conductivity value of over 53,691 S·m −1 of the Ag@CS20/epoxy was achieved, which led to exceptional EMI SE values of 69.1 dB. Furthermore, surface temperatures during heating and cooling were also investigated to demonstrate the superior heat dissipating capacity of the Ag@CS/epoxy composite, which can be potentially put an application as thermal dissipating material in the next generation of electronics.