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Resin, cure, and polymer properties of photopolymerizable resins containing bio‐derived isosorbide
Author(s) -
Lastovickova Dominika N.,
Toulan Faye R.,
Mitchell Joshua R.,
VanOosten David,
Clay Anthony M.,
Stanzione Joseph F.,
Palmese Giuseppe R.,
La Scala John J.
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.50574
Subject(s) - isosorbide , stereolithography , materials science , acrylate , glass transition , bisphenol a , polymer , photopolymer , composite material , bisphenol , acrylate polymer , polymer chemistry , polymerization , chemistry , epoxy , organic chemistry , copolymer
We have developed photocurable bio‐derived isosorbide (meth)acrylates for use in photoinitiated additive manufacturing (AM). We have shown that the viscosity of isosorbide‐based resins obeyed logarithmic rule of mixtures, and the viscosity values were significantly lower than that of commercial stereolithography (SLA) resins as well as various other urethane (meth)acrylates and bisphenol A (meth)acrylates‐containing blends. Using isobornyl acrylate or 4‐acryloylmorpholine as reactive diluents, we were able to reduce the brittleness of the isosorbide‐based polymers and retain high glass transition temperatures ( T g ) of up to 231°C. The isosorbide‐based resins were still somewhat brittle but had both greater T g and strength relative to analogous bisphenol A dimethacrylate resins. Addition of oligomeric urethane (meth)acrylate crosslinkers further improved the mechanical properties of the polymers, whereby the strength approximately doubled to 55 MPa at 25°C, while maintaining high thermal properties, T g > 190°C, and low viscosities, <140 cP, that are desirable for photoinduced AM applications. Furthermore, we were able to print this resin using SLA which produced specimens with similar moduls, but reduced strength relative to photocured resins and a commercial high temperature SLA resin.