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Synthesis of a novel lignin‐based epoxy resin curing agent and study of cure kinetics, thermal, and mechanical properties
Author(s) -
Chen Bing,
Zhang Qiang,
Lu Mangeng,
Meng Huifa,
Qu Zhencai,
Xu Chang'an,
Jiao Enxiang
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.50523
Subject(s) - epoxy , curing (chemistry) , diglycidyl ether , lignin , demethylation , bisphenol a , materials science , ultimate tensile strength , solvent , polymerization , thermal stability , polymer chemistry , chemistry , organic chemistry , composite material , polymer , biochemistry , gene expression , dna methylation , gene
Abstract In this contribution, first of all, the methoxy groups of organic solvent lignin (OSL) was converted to phenolic hydroxyl groups through demethylation reaction for the purpose of fabricating demethylated organic solvent lignin (DOSL). In addition, the resulting DOSL was utilized as a renewable material to synthesize a novel esterified lignin (EDOSL) by reacting with isobutyryl chloride for curing of epoxy resin. Finally, commercial liquid diglycidyl ether of bisphenol A was cured by EDOSL in the presence of 4‐dimethylaminopyridine (DMAP) used as a catalyst based on dual‐curing mechanism. Dual curing is a processing methodology based upon the alliance of two diverse and compatible polymerization reactions occurring sequentially or simultaneously. According to the FTIR spectra and 1 H‐NMR analyses, the demethylation of OSL, esterification of DOSL, and the curing reaction of epoxy resin with EDOSL were successfully conducted. The value of the phenolic hydrogen in the DOSL was approximately 4.89 mmol/g, which increased by 12.64% after demethylation. The thermal and mechanical performances of these cured epoxy samples were measured by DSC, DMA, TGA, and tensile testing. The epoxy system cured by 10%wt esterified lignin with 1%wt DMAP possessed the tensile strength of 71.54 ± 7.50 MPa and the initial degradation temperature ( T 5% ) of 370°C, which can compete fairly with commercial aromatic curing agents or other lignin‐based agents studied currently for the curing of epoxy systems.