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Antistatic packaging based on PTT / PTT‐ g ‐MA / ABS / MWCNT nanocomposites: Effect of the chemical functionalization of MWCNTs
Author(s) -
Braga Natália Ferreira,
Ding Hao,
Sun Luyi,
Passador Fabio Roberto
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.50005
Subject(s) - antistatic agent , materials science , surface modification , nanocomposite , carbon nanotube , acrylonitrile butadiene styrene , composite material , scanning electron microscope , chemical engineering , maleic anhydride , chemical modification , polymer , polymer chemistry , copolymer , layer (electronics) , engineering
Polymer/carbon nanotube nanocomposites have attracted high interest for a wide spectrum of applications, including antistatic packaging used to protect electronic devices against electrostatic discharge. Polytrimethylene terephthalate (PTT)/maleic‐anhydride‐grafted PTT (PTT‐ g ‐MA)/acrylonitrile butadiene styrene (ABS) blend‐based multiwall carbon nanotubes (MWCNTs) nanocomposites were prepared through extrusion. It was conducted chemical functionalization on the MWCNTs by oxidation using nitric acid to introduce functional groups. The effect of the amount (0.5 or 1.0 wt%) and functionalization of MWCNTs on the nanocomposites was investigated. Despite the poor barrier properties of PTT/PTT‐ g ‐MA/ABS/MWCNT nanocomposites due to the presence of voids confirmed by scanning electron microscopy (SEM), the nanocomposites with functionalized MWCNT (MWCNT f ) showed excellent barrier properties, indicating that the functionalization process improved the interaction between the MWCNTs and the matrix. The addition of MWCNTs into PTT/PTT‐ g ‐MA/ABS blend decreased the electrical resistivity by eight orders of magnitude. The use of MWCNT f may still disrupt the electrical network pathway and slightly decreasing the electrical resistivity, but the nanocomposites present the desired properties required for antistatic packaging.