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Preparation and properties of high‐strength‐high‐modulus polyimide cords/natural rubber composites
Author(s) -
Hu Xiaojun,
Zhang Mengying,
Sun Guohua,
Huang Wei,
Niu Hongqing,
Wu Dezhen
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.49733
Subject(s) - composite material , materials science , natural rubber , polyimide , adhesive , adhesion , epoxy , layer (electronics)
High‐strength‐high‐modulus polyimide (PI) cords reinforced natural rubber (NR) composites are prepared, and the PI cords are treated with resorcinol‐formaldehyde‐latex (RFL) adhesive to enhance the interfacial adhesion with NR matrix. The influence of RFL adhesive variables, such as the ratio of R/F and RF/L, on the adhesion between PI cords and NR is investigated. Furthermore, sorbitol glycidyl ether (SGE) and caprolactam blocked methylene diisocyanate (CBI) are adhered to the surface of the PI cords through a dip‐coating procedure to introduce epoxy and NCO groups and graft with more RFL adhesive. The H pull‐out force of SGE/CBI‐RFL treated PI cords/NR composites reaches as high as 193.9 N, which is 580% higher than that of untreated PI ones. Additionally, the SGE/CBI‐RFL treated PI cords/NR composites exhibit superior adhesion, aging, and fatigue resistance together with better mechanical properties as compared with SGE/CBI‐RFL treated poly(para‐phenylene terephtalamide) (PPTA) cords/NR composites.