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Investigation of packaging adhesive properties by molecular dynamics and experiments
Author(s) -
Cao Kaicong,
Zhou Wu,
Chen Lili,
He Jiangbo,
Zhan Li,
Chen Qing,
Yu Huijun,
He Xiaoping
Publication year - 2021
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.49613
Subject(s) - materials science , adhesive , curing (chemistry) , epoxy , composite material , diglycidyl ether , polymer , microelectronics , glass transition , modulus , bisphenol a , nanotechnology , layer (electronics)
Adhesive polymer is a common and important material used for packaging of microelectronics and microsystem by attaching dies onto packaging shell, and its mechanical property plays a vital role in isolating dies from the thermal stress of substrate. Therefore, it is extremely significant to evaluate the polymer property in a specific packaging process. The molecular dynamics (MD) simulation is conducted in this article to investigate the material properties of the cross‐linked epoxy resin formed by epoxy resin component diglycidyl ether bisphenol A (DGEBA) and curing agent 1,6‐Diaminohexane. The polymer network with conversion up to 87.5% is successfully generated and simulated by constant pressure‐constant temperature ensemble ( NPT ) and canonical ensemble ( NVT ) at different temperatures of curing process. Glass transition temperature ( T g ) and Young's modulus are extracted and the predicted material properties are in great agreement with the experimental data. The conclusion provides a guideline to design the special curing process for different adhesive requirements.