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Internal stress analysis of epoxy adhesively‐boned joints based on their thermomechanical properties at cryogenic temperature
Author(s) -
Li Hong,
Wang Kun,
Chen Gong,
Sun Lingyu,
Yang Jiping
Publication year - 2020
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.49311
Subject(s) - epoxy , materials science , composite material , diglycidyl ether , thermal expansion , thermomechanical analysis , adhesive , bisphenol a , glass transition , stress (linguistics) , layer (electronics) , polymer , linguistics , philosophy
Internal stress analysis is essential to structural design of materials applied in cryogenic engineering. In this contribution, thermomechanical properties including dynamic thermomechanical properties and thermal expansion behavior of four epoxy resins, namely the polyurethane modified epoxy resin (PUE), diglycidyl ether of bisphenol A (DGEBA), tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) and triglycidyl‐p‐aminophenol (TGPAP) were studied by dynamic thermomechanical analysis. Internal stress of the epoxy layer in the bonded joint was calculated based on the thermomechanical properties. Meanwhile, the structure‐cryogenic property relationship of epoxy resins were investigated. Results demonstrate that internal stress in the four epoxies bonded joints is 6 ~ 21 MPa at −150°C, and is positively correlated with the average thermal expansion coefficient (CTE) of epoxy resins. TGDDM and TGPAP showed higher retention of lap shear strength both at −196°C and after temperature cycling due to their lower CTE. Morphology of the fractured surface of bonded joints demonstrated that internal stress is responsible for the severe interface failure at −196°C. It reveals that selection of epoxy resins with low CTE is beneficial for designing high‐performance epoxy adhesive systems served at cryogenic temperature.