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New triepoxy monomer and composites for thermal and corrosion management
Author(s) -
Boga Karteek,
Rao Chepuri R. K.,
Suresh Kattimuttathu Ittara
Publication year - 2020
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.49251
Subject(s) - materials science , composite material , epoxy , thermal conductivity , corrosion , curing (chemistry) , coating , monomer , electronics , polymerization , polymer , chemistry
The denser and faster componented next‐generation electronic devices produce an increased amount of heat during operations. Thermal dissipation is critical to the performance, lifetime, and reliability of electronic devices. With emerging of new applications such as three‐dimensional chip stack architectures, flexible electronics, and light‐emitting diodes, thermal dissipation becomes a challenging problem. In this study, a new resole‐based epoxy monomer is designed. The novelty of the monomer is triepoxy functional soth upon curing (polymerization) the crosslink density is more. Composites of this epoxy with graphene functionalized with amine have been synthesized and characterized by thermal and mechanical methods. The thermal conductivity is increased to 0.6 W/mK by using graphene amine (12 wt%), which suggests that the composites can be useful for encapsulations. The composites are also useful as a coating material for corrosion protection on mild steel (MS). The electrochemical polarization studies on coated specimens showed that the composites are excellent coatings, which exhibited a very low corrosion rate of the order of 10 −3 –10 −4 mm/year.