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Studies on the curing behavior, thermal, and mechanical properties of epoxy resin‐co‐amine‐functionalized lead phthalocyanine
Author(s) -
Zu LiWu,
Li Jidong,
Gao BaoChang,
Pan ZhongCheng,
Wang Jun,
Liu WenBin,
Zegaoui Abdeldjalil,
Dayo Abdul Qadeer
Publication year - 2020
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.48983
Subject(s) - materials science , thermogravimetric analysis , epoxy , curing (chemistry) , dynamic mechanical analysis , differential scanning calorimetry , copolymer , composite material , ultimate tensile strength , thermal stability , fourier transform infrared spectroscopy , izod impact strength test , polymer , chemical engineering , physics , engineering , thermodynamics
A high performance copolymer was prepared by using epoxy (EP) resin as matrix and 3,10,17,24‐tetra‐aminoethoxy lead phthalocyanine (APbPc) as additive with dicyandiamide as curing agent. Fourier‐transform infrared spectroscopy, dynamic mechanical analysis (DMA), differential scanning calorimetric analysis (DSC), and thermogravimetric analysis (TGA) were used to study the curing behavior, curing kinetics, dynamic mechanical properties, impact and tensile strength, and thermal stability of EP/APbPc blends. The experimental results show that APbPc, as a synergistic curing agent, can effectively reduce the curing temperature of epoxy resin. The curing kinetics of the copolymer was investigated by non‐isothermal DSC to determine kinetic data and measurement of the activation energy. DMA, impact, and tensile strength tests proved that phthalocyanine can significantly improve the toughness and stiffness of epoxy resin. Highest values were seen on the 20 wt% loading of APbPc in the copolymers, energy storage modulus, and impact strength increased respectively 388.46 MPa and 3.6 kJ/m 2 , T g decreased 19.46°C. TGA curves indicated that the cured copolymers also exhibit excellent thermal properties.