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Damping, thermal, and mechanical performances of a novel semi‐interpenetrating polymer networks based on polyimide/epoxy
Author(s) -
Qu Chunhui,
Li Xiao,
Yang Zenghui,
Zhang Xinrui,
Wang Tingmei,
Wang Qihua,
Chen Shoubing
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.48032
Subject(s) - polyimide , materials science , epoxy , thermal stability , polymer , composite material , thermal , damping ratio , diamine , polymer chemistry , vibration , chemical engineering , thermodynamics , physics , acoustics , layer (electronics) , engineering
In this article, a series of novel semi‐interpenetrating polymer networks (s‐IPNs) based on linear polyimide (PI) and crosslinked epoxy (EP) were firstly prepared aiming at controlling violent vibration and noise originating from operation of the machine. The damping, thermal, and mechanical performances of s‐IPNs films were systematically investigated in terms of the structure of polyimide (the molar ratios of diamines) and the component ratios of PI/EP. The results indicate that PI/EP s‐IPNs films exhibit prominent damping properties, and the effective damping temperature range can reach up to 58.8 °C when molar ratio of diamines is 1:3 within PI and component ratio of PI/EP is 70:30. Meanwhile, all the PI/EP s‐IPNs films show good thermal stability compared to cured EP and certain mechanical behaviors due to the formation of semi‐interpenetrated structure. Meaningfully, the prepared novel PI/EP s‐IPNs will be used as effective damping materials and have a potential application in damping fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 48032.