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Latent curing agent DDM‐PMMA microcapsule for epoxy resin
Author(s) -
Zhao Liyang,
Yang Xiaojun,
Li Qingyang,
Ma Limin
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.47757
Subject(s) - materials science , epoxy , curing (chemistry) , composite material , adhesive , polyetherimide , fourier transform infrared spectroscopy , compatibility (geochemistry) , chemical engineering , polymer , layer (electronics) , engineering
A microcapsule‐type latent curing agent is prepared by solvent evaporation method with diaminodiphenylmethane (DDM) as the core material and PMMA as the wall material. The chemical structure, surface morphology, core content, and curing characteristics of as‐prepared microcapsule‐type curing agent are characterized by FTIR, SEM, TGA, and DSC. The results show that the obtained microcapsules have smooth surface and the core content is about 20 wt %. The one‐component adhesive consisting of DDM‐PMMA microcapsule and epoxy resin can be cured within 30 min at 130 °C, and the room temperature latent period is more than 30 days. In addition, the internal reasons influencing the core content of microcapsules are analyzed by comparing and analyzing the structural compatibility of three kinds of wall material PMMA, PS, and polyetherimide with DDM. The results show that the core content is affected by the compatibility of wall material and core material. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47757.