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Study on thermal conductive PA6 composites with 3‐dimensional structured boron nitride hybrids
Author(s) -
Wang Liang,
Wu Wei,
Drummer Dietmar,
Ma Renbo,
Liu Zhaowen,
Shen Wanting
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.47630
Subject(s) - composite material , materials science , boron nitride , thermal stability , electrical conductor , thermal conductivity , composite number , thermal , nitride , nanocomposite , filler (materials) , chemical engineering , physics , layer (electronics) , meteorology , engineering
ABSTRACT To develop thermally conductive PA6 composites with the aim of decreasing filler content, structure‐complexed fillers were fabricated. This research presented an effective approach by noncovalent functionalization of poly(dopamine) (PDA) followed by silver nanoparticles decoration to fabricate 3‐dimensional (3‐D) structured boron nitride hybrids (BN@PDA@AgNPs). BN hybrids were then introduced into PA6 to prepare thermally conductive PA6 composites. The results demonstrated that PA6/BN hybrids (PMB) composites exhibited higher thermal conducivity compared with PA6/BN composites, which revealed more effective construction of thermal conductive network in the composites with the addition of 3‐D structured fillers. The effects of BN hybrids with different loadings on thermal stability, mechanical property, as well as electrical resistance of the composites were also analyzed. Overall, the prepared PMB composites exhibited outstanding performance in thermal conductivity, thermal stability, mechanical property, while retaining good electrical insulating property, which showed a potential application in electronic packaging fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47630.