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Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing
Author(s) -
Liang Zhihao,
Wang Xiaomei,
Feng Liangting,
Wu Xuefen
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.47428
Subject(s) - oligomer , materials science , curing (chemistry) , copolymer , differential scanning calorimetry , thermogravimetric analysis , polymer chemistry , composite material , uv curing , monomer , chemical engineering , polymer , physics , engineering , thermodynamics
A novel solder resist ink for inkjet printing containing the ultraviolet (UV) and thermal dual curing oligomer is introduced in this work. Three kinds of acrylic monomers for the synthesis of the oligomer are successful prepared and their structures are determined by Fourier transfer infrared. Both UV curing process and thermostability are monitored under UV differential scanning calorimetry and thermogravimetric analysis. For the photoreaction process, the oligomer using Lauryl methacrylate as the material of copolymerization possesses the highest reactivity and conversion of carbon–carbon double bond. Besides, this kind of oligomer also owns excellent thermostability, just losing 5.9% of its weight at 288 °C. The solder resist inks containing the oligomers and jetting by the inkjet printer are tested with the adhesion, soldering resistance, and other performances, presenting the outstanding heat resistance and wide application prospects. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47428.