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Synthesis of a novel biphenyl epoxy resin and its hybrid composite with high thermal conductivity
Author(s) -
Na T.,
Che S.,
Sun Y.,
Liu X.,
Hao J.,
Zhao C.
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.47078
Subject(s) - epoxy , materials science , composite material , thermal conductivity , composite number , monomer , mass fraction , biphenyl , filler (materials) , thermal conduction , conductivity , viscosity , polymer , polymer chemistry , chemistry , organic chemistry
A novel biphenyl epoxy monomer of p ‐methyl phenylhydroquinone epoxy resin ( p ‐MEP) was synthesized and characterized. We researched its potential in the area of thermal conduction application and prepared a series of hybrid composites based on it with different mass ratios of sphere Al 2 O 3 filler. From the good mobility and low viscosity of p ‐MEP, it allowed mixing with more Al 2 O 3 fillers. The hybrid epoxy resins owned the advantages of traditional epoxy resins as well as quite considerable thermal conductivity. Therefore, the hybrid composite at the maximum mass fraction of 70% possess the highest thermal conductivity of 5.6 W mK −1 , which is 5.6 times higher than that of pristine p ‐MEP (0.1 W mK −1 ). © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47078.