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3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway
Author(s) -
Yan Changzeng,
Yu Tianhang,
Ji Chao,
Zeng Xiaoliang,
Lu Jibao,
Sun Rong,
Wong ChingPing
Publication year - 2019
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.47054
Subject(s) - materials science , nanocomposite , epoxy , composite material , electrical conductor , thermal stability , thermal conductivity , coating , nanowire , filler (materials) , polymer nanocomposite , nanotechnology , chemical engineering , engineering
Heat removal via thermal management materials is attracting more and more attention in the electronic industry. Conventional particle/polymer thermal conductive composites require a high filler loading ratio (>30 vol %), which cause severe thermal interfacial resistance and mechanical issue. In this work, we fabricate tellurium nanowires (NWs)/epoxy nanocomposites via a facile bar coating method. According to Agari model and Maxwell–Eucken model, the as‐synthesized ultra‐long NWs with high aspect ratio (>100) construct the 3D interconnected thermal conductive network better in resin matrix to facilitate the heat transfer process. The results show that at a low loading ratio of 2.4 vol %, this nanocomposite exhibits the out‐of‐plane and in‐plane thermal conductivity of 0.378 and 1.63 W m −1 K −1 , respectively, which is 189 and 715% higher than that of pure epoxy resin. Importantly, good stability, and flexibility of nanocomposites are well maintained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47054.