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Epoxy terminated polysiloxane blended with diglycidyl ether of bisphenol‐A. 1: Curing behavior and compatibility
Author(s) -
Yang Yang,
Li Weizhen,
Chen Kaimin,
Gan Wenjun,
Wang Cheng
Publication year - 2018
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.46891
Subject(s) - diglycidyl ether , epoxy , differential scanning calorimetry , bisphenol a , glass transition , curing (chemistry) , dynamic mechanical analysis , materials science , polymer chemistry , composite material , ether , polymer , chemistry , organic chemistry , thermodynamics , physics
An epoxypropoxypropyl terminated polydimethylsiloxane (DMS‐E09) is blended with a commercial epoxy resin [diglycidyl ether of bisphenol‐A (DGEBA)], using methyl tetrahydrophthalic anhydride as a curing agent in the presence of the accelerator N , N ‐dimethyl benzyl amine. The co‐curing behaviors, glass‐transition temperature ( T g ) are studied by differential scanning calorimetry (DSC) and curing kinetic parameters are calculated by Kissinger and Ozawa methods. It is found that the apparent activation energy for DMS‐E09 is slightly lower than that of the DGEBA by 9–10 kJ mol −1 . Dynamic mechanical analysis is subsequently employed and reveals that the value of T g (peak of tan δ at higher temperature) consists with the result of DSC very well. With the increase of DMS‐E09 content, storage modulus and the values of T g and T β (peak of tan δ at lower temperature) all have a tendency of decreasing monotonically. Furthermore, T g and T β follow Fox and Gordon‐Taylor expression well, indicating compatible networks in certain level are obtained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135 , 46891.