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Effects of hollow microspheres on the thermal insulation of polysiloxane foam
Author(s) -
Zhang Chunling,
Zhang Chunyu,
Huang Rong,
Gu Xiaoyan
Publication year - 2017
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.44778
Subject(s) - thermogravimetric analysis , materials science , differential scanning calorimetry , thermal stability , fourier transform infrared spectroscopy , composite material , scanning electron microscope , glass microsphere , thermal conductivity , thermal insulation , microsphere , chemical engineering , physics , layer (electronics) , engineering , thermodynamics
Polysiloxane foam (SIF) was prepared through foaming and crosslinking processes and reinforced with modified hollow microspheres (HMs). The HM filler was modified with vinyl trimethoxysilane to improve the compatibility between the vinyl trimethoxysilane modified hollow microsphere (VMS–HM) and the matrix. The treated HMs were characterized through Fourier transform infrared spectroscopy, environmental scanning electron microscopy, and energy spectroscopy. The thermal stability and insulation of the composites were investigated through differential scanning calorimetry, thermogravimetric analysis, and thermal conductivity. SIF with 5% VMS–HMs yielded a minimum thermal conductivity of 0.078 W/mK. The thermal stability was improved by the addition of HM, and the mechanical properties were significantly enhanced. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 133 , 44778.