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Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy
Author(s) -
Yang JianWei,
Wang ZhengZhou,
Liu Lei
Publication year - 2017
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.44599
Subject(s) - dicyclopentadiene , epoxy , diglycidyl ether , thermogravimetric analysis , materials science , curing (chemistry) , differential scanning calorimetry , bisphenol a , thermal stability , limiting oxygen index , polymer chemistry , nuclear chemistry , composite material , polymerization , chemistry , polymer , organic chemistry , pyrolysis , physics , char , thermodynamics
A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n ‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, 1 H NMR and 31 P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature ( T g ) is a bit lower (133 °C). The T g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134 , 44599.