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Octakis(ethynyldimethylsiloxy) silsesquioxane: Synthesis and application in poly(silicane arylacetylene) resin
Author(s) -
Bu Xiaojun,
Zhou Yan,
Li Chuan,
Huang Farong
Publication year - 2016
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.44158
Subject(s) - materials science , silsesquioxane , thermosetting polymer , nanoindentation , polymer chemistry , original equipment manufacturer , curing (chemistry) , chemical engineering , composite material , polymer , computer science , engineering , operating system
Octakis(ethynyldimethylsiloxy)silsesquioxane (OEMS) was first synthesized via hydrolysis condensation reaction between tetramethylammonium octaanion and ethynyldimethylchlorosilane, and characterized by FT‐IR, NMR, and GPC methods. A series of OEMS modified poly(silicane arylacetylene) resins (OEMS‐PSAs) were prepared from OEMS and poly(silicane arylacetylene) (PSA). TEM analysis of the OEMS‐PSAs confirms that the nano‐sized polyhedral oligomeric silsesquioxanes (POSS) are dispersed evenly in low content, but aggregated unregularly in high content in OEMS‐PSAs. The curing behavior of OEMS‐PSAs was studied with DSC and FT‐IR techniques. Nanoindentation test shows the incorporation of OEMS into PSA could decrease both of the elastic modulus and surface hardness of the PSA thermoset. The dielectric constants (ɛ r ) of the OEMS‐PSA thermosets approach to 2.1, depending on not only the content of POSS but also the dispersion of POSS. Furthermore, TGA results demonstrate the OEMS‐PSA thermosets possess the certain thermo‐oxidative resistance. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133 , 44158.