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Selective preparation of oligomeric naphthylene ether and its applications to epoxy resin for silicon carbide power semiconductor device materials
Author(s) -
Arita Kazuo,
Oyama Toshiyuki
Publication year - 2016
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.43339
Subject(s) - epoxy , materials science , thermal stability , potassium hydroxide , thermal decomposition , silicon carbide , ether , glass transition , composite material , silicon , chemical engineering , polymer chemistry , polymer , organic chemistry , chemistry , engineering , metallurgy
In this study, a novel method for selective synthesis of naphthylene ether trimers by self‐condensation of 2,7‐dihydroxynaphthalene in the presence of catalytic amount of potassium hydroxide was reported. An epoxy resin from the trimers was prepared and properties of the cured epoxy resin were examined. The cured resin showed not only good physical thermal stability, such as high glass transition temperature and low thermal expansion coefficient, but also good chemical thermal stability like high thermal decomposition temperature. Additionally, low moisture absorption of the cured resin was confirmed. From these results, the newly prepared epoxy resin with naphthylene ether skeletons was considered to be suitable for advanced applications such as silicon carbide power semiconductor device. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133 , 43339.