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Low dielectric and high thermal conductivity epoxy nanocomposites filled with NH 2 ‐POSS/n‐BN hybrid fillers
Author(s) -
Wu Yalan,
Li Fang,
Huyan Juanni,
Zou Xiaorong,
Li Ying
Publication year - 2015
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.41951
Subject(s) - silsesquioxane , nanocomposite , materials science , epoxy , dielectric , thermal stability , boron nitride , composite material , thermal conductivity , chemical engineering , polymer , optoelectronics , engineering
Hybrid fillers of mono‐amine polyhedral oligomeric silsesquioxane/nanosized boron nitride (NH 2 ‐POSS/n‐BN) were performed to fabricate NH 2 ‐POSS/n‐BN/epoxy nanocomposites. Results revealed that the dielectric constant and dielectric loss values were decreased with the increasing addition of NH 2 ‐POSS obviously, but increased with the increasing addition of BN fillers. For a given loading of NH 2 ‐POSS (5 wt %), the thermal conductivities of NH 2 ‐POSS/n‐BN/epoxy nanocomposites were improved with the increasing addition of n‐BN fillers, and the thermal conductivity of the nanocomposites was 1.28 W/mK with 20 wt % n‐BN fillers. Meantime, the thermal stability of the NH 2 ‐POSS/n‐BN/epoxy nanocomposites was also increased with the increasing addition of n‐BN fillers. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132 , 41951.