Low dielectric and high thermal conductivity epoxy nanocomposites filled with NH 2 ‐POSS/n‐BN hybrid fillers

Hybrid fillers of mono‐amine polyhedral oligomeric silsesquioxane/nanosized boron nitride (NH 2 ‐POSS/n‐BN) were performed to fabricate NH 2 ‐POSS/n‐BN/epoxy nanocomposites. Results revealed that the dielectric constant and dielectric loss values were decreased with the increasing addition of NH 2 ‐POSS obviously, but increased with the increasing addition of BN fillers. For a given loading of NH 2 ‐POSS (5 wt %), the thermal conductivities of NH 2 ‐POSS/n‐BN/epoxy nanocomposites were improved with the increasing addition of n‐BN fillers, and the thermal conductivity of the nanocomposites was 1.28 W/mK with 20 wt % n‐BN fillers. Meantime, the thermal stability of the NH 2 ‐POSS/n‐BN/epoxy nanocomposites was also increased with the increasing addition of n‐BN fillers. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132 , 41951.