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Self‐healing Ag/epoxy electrically conductive adhesive using encapsulated epoxy‐amine healing chemistry
Author(s) -
Tao Yu,
Chang Yu,
Tao Yuxiao,
Wu Haiping,
Yang Zhenguo
Publication year - 2015
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.41483
Subject(s) - epoxy , electrical conductor , adhesive , materials science , composite material , amine gas treating , electrical resistivity and conductivity , self healing , polymer chemistry , chemistry , organic chemistry , medicine , alternative medicine , layer (electronics) , pathology , electrical engineering , engineering
In this study, a dual‐microcapsule epoxy‐amine self‐healing concept is used for electrically conductive adhesives (ECAs). It provides the ECA samples with the ability to recover mechanical and electrical properties automatically. Epoxy and amine microcapsules were prepared and incorporated into silver/epoxy ECAs. The healing efficiency and bulk resistivity of the undamaged, damaged, and healed specimens were measured, respectively. The optimal loading of the epoxy and amine microcapsules is 6 wt % (weight ratio 1.05), and the bulk resistivity of the healed specimens is 3.4 × 10 −3 Ω cm. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132 , 41483.