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Curing behavior of epoxy resins in two‐stage curing process by non‐isothermal differential scanning calorimetry kinetics method
Author(s) -
Sun He,
Liu Yuyan,
Wang Youshan,
Tan Huifeng
Publication year - 2014
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.40711
Subject(s) - curing (chemistry) , differential scanning calorimetry , materials science , isothermal process , epoxy , activation energy , order of reaction , fourier transform infrared spectroscopy , kinetics , composite material , kinetic energy , thermodynamics , chemical engineering , chemistry , reaction rate constant , physics , quantum mechanics , engineering
In this research, a new thermal curing system, with two‐stage curing characteristics, has been designed. And the reaction behaviors of two different curing processes have been systematically studied. The non‐isothermal differential scanning calorimetry (DSC) test is used to discuss the curing reaction of two stages curing, and the data obtained from the curves are used to calculate the kinetic parameters. Kissinger‐Akahira‐Sunose (KAS) method is applied to determine activation energy ( E a ) and investigate it as the change of conversion (α). Málek method is used to unravel the curing reaction mechanism. The results indicate that the curing behaviors of two different curing stages can be implemented successfully, and curing behavior is accorded with Šesták‐Berggren mode. The non‐isothermal DSC and Fourier transform infrared spectroscopy test results reveal that two different curing stages can be implemented successfully. Furthermore, the double x fitting method is used to determine the pre‐exponential factor ( A ), reaction order ( m , n ), and establish the kinetic equation. The fitting results between experiment curves and simulative curves prove that the kinetic equation can commendably describe the two different curing reaction processes. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131 , 40711.