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Epoxy compositions cured with aluminosilsesquioxanes: Thermomechanical properties
Author(s) -
Chmielewska Danuta,
Sterzyński Tomasz,
Dudziec Beata
Publication year - 2014
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.40672
Subject(s) - epoxy , dynamic mechanical analysis , materials science , curing (chemistry) , composite material , glass transition , bisphenol a , scanning electron microscope , thermomechanical analysis , fourier transform infrared spectroscopy , thermal analysis , modulus , polymer , thermal expansion , thermal , chemical engineering , physics , meteorology , engineering
The aim of this study was to verify the influence of bis(heptaphenylaluminosilsesquioxane) (AlPOSS), used as a curing agent, on the thermomechanical properties of epoxy resin. Moreover, various curing conditions were taken into account. Epoxy casts were prepared from epoxy resin based on bisphenol A cured with different amounts of bis(heptaphenylaluminosilsesquioxane). The thermomechanical properties were investigated during dynamical mechanical thermal analysis (DMTA) in two cycles of heating. The storage modulus G ′ of the epoxy casts was found to be higher in comparison to the reference epoxy sample and significantly dependent on the POSS content. A correlation between the glass transition temperatures ( T g ), the curing conditions and the amount of curing agents were closely related. The occurrence of the crosslinking process in epoxy matrix was proved by the FTIR spectroscopy. The structure of the epoxy casts was investigated using scanning electron microscopy (SEM). © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131 , 40672.