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Low temperature curable epoxy siloxane hybrid materials for LED encapsulant
Author(s) -
Kim HweaYoon,
Bae Junyoung,
Kim Yong Ho,
Kim Yu Bae,
Bae ByeongSoo
Publication year - 2014
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.39968
Subject(s) - epoxy , siloxane , materials science , cationic polymerization , composite material , oxetane , polymerization , polymer chemistry , polymer
A thermally cured epoxy‐siloxane hybrid material that is curable at low temperature (L‐expoxy hybrimer) was investigated for use as an LED encapsulant. This new hybrimer was fabricated using thermally initiated, cationic polymerization of cycloaliphatic epoxy oligosiloxane (CAEO) resin, derived from non‐hydrolytic sol – gel, mixed with oxetane hardener in the presence of a hexafluoroantimonate‐type thermo‐cationic initiator. The L‐epoxy hybrimer was cured at a lower temperature (below 120 ° C) than previously reported for an epoxy hybrimer with anhydride hardener (above 180 ° C). The L‐epoxy hybrimer showed high thermal resistance to yellowing under long‐term high temperature condition, and maintained good optical transmittance. Also, it had a high refractive index (up to 1.57), as well as the hardness (Shore D 80), and low water‐vapor permeability, w hen the new hybrimer was used to encapsulate an LED, it showed good adhesion without cracks or delamination and maintained their initial performance after the long‐term aging tests (120 and 85 ° C at 85% humidity). © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131 , 39968.