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Back Cover, Volume 131, Issue 3
Publication year - 2014
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.39963
Subject(s) - cover (algebra) , polymer , volume (thermodynamics) , thermal conductivity , materials science , citation , nanotechnology , polymer science , computer science , physics , composite material , mechanical engineering , world wide web , thermodynamics , engineering
Polymer/hexagonal boron nitride (h‐BN) composites have attracted attention as heat dissipative materials for numerous electronic devices. Shusuke Yoshihara et al. reveal that a perpendicular relationship between the polymer and h‐BN platelet orientations results in a dramatic enhancement of the composite thermal conductivity. The cover image shows crystalline lamellae align along the h‐BN platelets, which are closely stacked one above the other. Polymer chains align perpendicularly to the platelets and behave as effective heat paths between the platelets, leading to the formation of a continuous thermal network. DOI: 10.1002/app.39768