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Mechanical and dielectric properties of short‐carbon‐fibers/epoxy‐modified‐organic‐silicone‐resin as heat resistant microwave absorbing coatings
Author(s) -
Huang Shanshan,
Zhou Wancheng,
Luo Fa,
Zhu Dongmei
Publication year - 2013
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.39307
Subject(s) - materials science , epoxy , silicone , composite material , silicone resin , permittivity , microwave , dielectric , reflection loss , adhesive , dielectric loss , carbon fibers , coating , layer (electronics) , composite number , physics , optoelectronics , quantum mechanics
Heat resistant microwave absorbing coatings were prepared by brushing and thereafter heat treatment, using epoxy modified organic silicone resin as binding material, short carbon fibers (C sf ) as absorbers, talcum powder and glass powder as filling materials. The mechanical and dielectric properties of the coatings before and after heat treatment at 600°C for 10 mins were studied. The results showed that the adhesive power after heat treatment enhances remarkably, both the real (ε′) and imaginary (ε″) parts of the permittivity of the coatings increase with increasing C sf content in the frequency range of 8.2–12.4 GHz. The calculation value of the reflection loss as single layer absorber indicates that epoxy modified organic silicone resin coatings containing short carbon fibers could be a promising radar absorbing material applied at high temperature. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 1392‐1398, 2013