Premium
Inside Cover, Volume 130, Issue 3
Publication year - 2013
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.39087
Subject(s) - cover (algebra) , epoxy , agglomerate , polymer science , microelectronics , economies of agglomeration , computer science , composite material , materials science , mechanical engineering , nanotechnology , engineering , chemical engineering
Epoxy resins are versatile raw materials for industrial products, such as windmill blades, aerospace parts, generator encapsulations, microelectronics, and structural adhesives. Stephan Sprenger on page 1421 gives an overview of the state of research, with a focus on mechanical properties. In a cured epoxy resin, nanosilica should be monodispersed. Most research shows well‐dispersed nanoparticles and claims that improvements are a result of the good dispersion. The cover image shows agglomerates in cured epoxy resin, where the agglomeration is induced upon cure with an additive.