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Soybean meal‐based adhesive enhanced by MUF resin
Author(s) -
Gao Qiang,
Shi Sheldon Q.,
Zhang Shifeng,
Li Jianzhang,
Wang Xiaomei,
Ding Wubin,
Liang Kaiwen,
Wang Jinwu
Publication year - 2012
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.36700
Subject(s) - adhesive , materials science , soybean meal , urea formaldehyde , composite material , sodium hydroxide , shear strength (soil) , formaldehyde , peg ratio , nuclear chemistry , chemistry , raw material , layer (electronics) , organic chemistry , environmental science , finance , soil science , economics , soil water
Abstract Soybean meal flour, polyethylene glycol (PEG), sodium hydroxide (NaOH), and a melamine‐urea‐formaldehyde (MUF) resin were used to formulate soybean meal/MUF resin adhesive. Effects of the adhesive components on the water resistance and formaldehyde emission were measured on three‐ply plywood. The viscosity and solid content of the different adhesive formulations were measured. The functional groups of the cured adhesives were evaluated. The results showed that the wet shear strength of plywood bonded by soybean meal/NaOH adhesive increased by 33% to 0.61 MPa after adding NaOH into the adhesive formulation. Addition of PEG reduced the viscosity of the soybean meal/NaOH/PEG adhesive by 91% to 34,489 cP. By using the MUF resin, the solid content of the soybean meal/MUF resin adhesive was improved to 39.2%, the viscosity of the adhesive was further reduced by 37% to 21,727 cP, and the wet shear strength of plywood bonded by the adhesive was increased to 0.95 MPa, which met the interior plywood requirements (≥0.7 MPa). The formaldehyde emission of plywood bonded by the soybean meal/MUF resin adhesive was obtained at 0.28 mg/L, which met the strictest requirement of the China National Standard (≤0.5 mg/L). FTIR showed using the MUF resin formed more CH 2 group in the cured adhesive. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012