Premium
Preparation and properties of maleimide‐functionalized hyperbranched polysiloxane and its hybrids based on cyanate ester resin
Author(s) -
Hu Jiangtao,
Gu Aijuan,
Liang Guozheng,
Zhuo Dongxian,
Yuan Li
Publication year - 2012
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.36688
Subject(s) - cyanate ester , curing (chemistry) , materials science , maleimide , dielectric , polymer chemistry , hybrid , composite material , hybrid material , toughness , dielectric loss , botany , optoelectronics , biology , nanotechnology
A new hyperbranched polysiloxane containing maleimide (HPMA) was synthesized through the reaction between N ‐(4‐hydroxyphenyl) maleimide and 3‐glycidoxypropyltrimethoxysilane, which was then used to prepare cyanate ester (CE) resin‐based hybrids (coded as HPMA x /CE, where x is the weight fraction of HPMA in the hybrid). The curing behavior of uncured hybrids and the typical properties (impact strength and dielectric properties) of cured hybrids were systemically investigated. Results show that the performance of hybrids is greatly related with the content of HPMA. Hybrids have obviously lower curing temperature than CE, overcoming the poor curing characteristics (higher curing temperature and longer curing time) of neat CE, for example, the curing peak temperature of HPMA20/CE is about 65°C lower than that of CE. In the case of cured resin and hybrids, the hybrids exhibit decreased dielectric constant and loss than CE resin; moreover, the former also exhibits lower water absorption than the latter. Specifically, the dielectric loss of HPMA15/CE hybrid is only about 27% of that of neat CE resin. In addition, the hybrids with suitable contents of HPMA have significantly improved impact strengths. The overall improved properties suggest that HPMA x /CE hybrids have great potential in applications needing harsh requirements of curing feature, dielectric properties, and toughness. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012