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Curing octaepoxysilsesquioxane with different curing agents
Author(s) -
Zhang Zengping,
Liang Guozheng,
Fang Changqing,
Pei Jianzhong,
Chen Shuanfa
Publication year - 2012
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.36452
Subject(s) - curing (chemistry) , thermal stability , materials science , nanocomposite , fourier transform infrared spectroscopy , silsesquioxane , polymer chemistry , hydrolysis , nuclear chemistry , composite material , chemical engineering , polymer , chemistry , organic chemistry , engineering
Abstract Octaepoxysilsesquioxane (POSS‐Ep) was first synthesized by the hydrolysis and condensation of γ‐[(2,3)‐epoxypropoxy]propyltrimethoxysilicane (KH‐560) with the presence of ethanol and HCl at 55°C for 72 h. Then, it was cured with 4,4′‐diaminodiphenylsulfone (DDS) and methylnadic anhydride (MNA), respectively. The curing reactions between POSS‐Ep and DDS or MNA were investigated by FTIR. Thermal stability of the cured nanocomposites was studied by TGA. The micromophologies of the obtained hybrids were observed by SEM. FTIR results show that POSS‐Ep can be cured completely with DDS or MNA to obtain the final organic–inorganic (O–I) hybrids after the same experimental curing cycle: 120°C/2 h + 140°C/2 h + 160°C/2 h + 180°C/2 h + 200°C/2 h. TGA results show that POSS‐Ep/DDS hybrid displays better thermal stability than that of POSS‐Ep/MNA hybrid. Initial thermal degradation temperature (Tdi) of POSS‐Ep/DDS hybrid is 420°C, 195°C higher than that of POSS‐Ep/MNA (225°C). SEM images of the fracture surfaces of the hybrids suggest the cured POSS‐Ep possesses good mechanical properties. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012