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Thermal and morphology properties of various silica contents in sulfone epoxy nanocomposites
Author(s) -
Chiu YieChan,
Tsai HsiehChih,
Imae Toyoko
Publication year - 2012
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.36277
Subject(s) - silanol , materials science , thermal stability , nanocomposite , curing (chemistry) , char , chemical engineering , polymer chemistry , silane , glass transition , epoxy , composite material , organic chemistry , polymer , chemistry , catalysis , pyrolysis , engineering
The effect of spherical silica oxide, tetraethoxyl silane (TEOS), and 5 polysilsesquioxane (POSS) derivative on the thermal and morphology properties in the sulfone epoxy (SEP) nanocomposite have been investigated in this study. The hydroxyl group (silanol groups) of silica improved the curing reactivity of SEP and increased the glass transition temperature ( T g ) from 132°C to 162°C. The POSS type silica formed bulky side‐chains in the nanocomposites, and the organic i ‐butyl, ethyl, methyl, and un‐reacted hydroxy groups influenced thermal stability. The char yield increased from 35.77% to 42.18% and 1.12% to 7.17% under nitrogen and air in thermal gravimetric analysis, respectively. From an investigation of thermal degradation, it was determined that the introduction of diphenylphosphine modified polysilsesquioxane (DPPP‐PSQ), spherical silica particles (SiO 2 ), and TEOS to the SEP enhanced the thermal stability beyond that provided by POSS side‐chain SEP nanocomposites. The addition of silica segments provided not only thermally stable char to reduce anti‐thermal oxidation properties but also enhanced thermal degradation stability of various silica‐containing/SEP nanocomposites. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012