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Mechanical and dielectric properties of epoxy resin modified using reactive liquid rubber (HTPB)
Author(s) -
Zhou Wenying,
Cai Jiangtao
Publication year - 2011
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.35417
Subject(s) - epoxy , materials science , composite material , fourier transform infrared spectroscopy , curing (chemistry) , natural rubber , ultimate tensile strength , dielectric , polybutadiene , scanning electron microscope , izod impact strength test , flexural strength , polymer , copolymer , chemical engineering , optoelectronics , engineering
In the present study, hydroxyl‐terminated polybutadiene (HTPB) liquid rubber was employed to modify epoxy resin using 2,4,6‐tri (dimethylaminomethyl) phenol as a catalyst, and methyl hexahydrophthalic anhydride as a curing agent. The reactions between HTPB and epoxy were monitored by Fourier transform infrared (FTIR); the mechanical and dielectric properties of HTPB modified epoxies were evaluated and the morphology was investigated through scanning electronic microscopy (SEM). The FTIR analysis evidenced the occurrence of a chemical reaction between the two components. The mechanical results indicated that the impact strength of HTPB‐modified epoxy was superior to that of the pure epoxy. As the HTPB content increased up to 10 phr the best mechanical performances in terms of tensile and flexural properties were achieved when compared to the unmodified epoxy. Higher concentration of HTPB resulted in larger particles and gave lower mechanical strength values. The incorporation of HTPB into epoxy decreased the dielectric constant and dissipation factor over a wide frequency range from 1 to 10 6 Hz, and improved the electrical resistivity. SEM micrographs showed that the modified epoxy exhibited a two‐phase morphology where the spherical rubber domains were dispersed in the epoxy matrix. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012