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Polymerization shrinkage/stress and dentin bond strength of silorane and dimethacrylate‐based dental composites
Author(s) -
Li Yuncong,
Sun Xiang,
Chen Jihua,
Xiong Jie,
Hu Xiaoyi
Publication year - 2011
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.35109
Subject(s) - materials science , shrinkage , composite material , dentin , adhesive , bond strength , composite number , polymerization , curing (chemistry) , polymer , layer (electronics)
This study was designed to determine whether a new dedicated adhesive system using a silorane composite exhibits better bonding performance to human dentin than conventional dimethacrylate‐based composites. The materials were used included: Adper™ Easy Bond‐Z250 (AE‐Z250), iBond‐Venus (IB‐VE), XenoIII‐TPH (XE‐TPH), Clearfil S3‐Clearfil Majesty (S3‐CM), and the Filtek silorane system (SA‐FS). Polymerization volumetric shrinkage and stress development were measured using a micro‐CT instrument and universal testing machine. The push out strength of the bonds produced using the corresponding self‐etching adhesive systems were also measured. The volumetric shrinkage of the resin composite/adhesive combinations ranged from 1.05% (SA‐FS) to 3.38% (XE‐TPH) 30 min after light curing. SA‐FS had the lowest volumetric shrinkage ( P < 0.05), followed by S3‐CM, EA‐Z250, IB‐VE, and XE‐TPH. The polymerization stress of the materials ranged from 1.54 (SA‐FS) to 3.49 MPa (S3‐CM). The lowest stress was also observed in SA‐FS at 30 min during the stress test ( P < 0.05). Push‐out bond strength testing revealed that IB‐VE had significantly lower bond strength than other combinations ( P < 0.05). The silorane composite and dedicated adhesive system exhibited excellent characteristics of low volumetric shrinkage and stress development compared to conventional dimethacrylate‐based composites. However, the silorane composite resin system possessed similar push‐out bond strength as the other materials, with the exception of the Venus/iBond combination. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012