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Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites
Author(s) -
Gu Junwei,
Zhang Qiuyu,
Dang Jing,
Yin Changjie,
Chen Shaojie
Publication year - 2011
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.35089
Subject(s) - materials science , composite material , silicon carbide , whisker , thermal conductivity , polystyrene , volume fraction , particle (ecology) , polymer , oceanography , geology
The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ‐105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient λ improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3 : 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ‐105 could improve the thermal conductivity and the mechanical properties of the composites. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012