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Effects of the size and filler loading on the properties of copper‐ and silver‐nanoparticle‐filled epoxy composites
Author(s) -
Chan K. L.,
Mariatti M.,
Lockman Z.,
Sim L. C.
Publication year - 2011
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.33798
Subject(s) - nanocomposite , materials science , epoxy , composite material , percolation threshold , nanoparticle , copper , particle size , percolation (cognitive psychology) , electrical resistivity and conductivity , silver nanoparticle , chemical engineering , nanotechnology , metallurgy , engineering , neuroscience , biology , electrical engineering
Copper‐nanoparticle (CuNP)‐filled nanocomposites were prepared with various particle sizes and loadings. The nanocomposites incorporating 20‐nm CuNPs with 5 vol % loading displayed optimum properties as determined by electrical, mechanical, and thermal characterization. Silver nanoparticles (AgNPs) with a size of 20 nm were loaded into the epoxy resin to allow a comparison of the properties. Interestingly, at the percolation threshold, a 5 vol % loading of CuNP and AgNP nanocomposites resulted in slightly similar electrical conductivities of 0.01 and 0.02 S/cm, respectively. The CuNP and AgNP nanocomposites were also subjected to thermal aging at 150°C, and we observed that the electrical conductivity of both nanocomposites dropped only by about one order of magnitude after 8 weeks of exposure. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011
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