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Effect of the cross‐linking process on the electrical resistivity and shape‐memory behavior of cross‐linked carbon black filled ethylene‐octene copolymer
Author(s) -
Le Hai Hong,
Ali Zulfiqar,
Uthardt Mathias,
Ilisch Sybill,
Radusch HansJoachim
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.33388
Subject(s) - carbon black , materials science , electrical resistivity and conductivity , octene , copolymer , composite material , electrical resistance and conductance , ethylene , compression molding , polymer chemistry , polymer , chemistry , catalysis , organic chemistry , mold , natural rubber , electrical engineering , engineering
The electrical resistance of carbon black (CB) filled ethylene‐octene copolymer (EOC) was monitored during the compression molding step by means of conductivity sensors. It increases strongly during the cross‐linking process due to the de‐agglomeration of CB aggregates. After completion of cross‐linking reaction CB aggregates reagglomerate causing a decay of resistance. The electrically stimulated shape‐memory (SM) behavior was found to be strongly dependent on the extent of electrical resistivity and the rigidity of CB network, which is formed during compounding and subsequent cross‐linking process. The effect of amount of peroxide and cross‐linking conditions like time and temperature on resistivity and the related SM behavior was characterized. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011