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Preparation and properties of high‐performance polysilsesquioxanes/bismaleimide‐triazine hybrids
Author(s) -
Hu JiangTao,
Gu Aijuan,
Liang Guozheng,
Zhuo Dongxian,
Yuan Li
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.33144
Subject(s) - curing (chemistry) , dielectric , materials science , thermal stability , dielectric loss , maleimide , hybrid , composite material , polymer chemistry , chemistry , organic chemistry , botany , optoelectronics , biology
A novel kind of high‐performance hybrids (coded as POSS‐NH 2 /BT) with significantly decreased curing temperature, lowered dielectric constant and loss, and improved thermal resistance were developed, which were prepared by copolymerizing bismaleimide with cage octa(aminopropylsilsesquioxane) (POSS‐NH 2 ) to produce POSS‐containing maleimide, and then co‐reacted with 2,2′‐bis(4‐cyanatophenyl) isopropylidene. The curing behavior and typical properties of cured POSS‐NH 2 /BT were systematically investigated. Results show that POSS‐NH 2 /BT hybrids have lower curing temperatures than BT resin because of the additional reactions between OCN and amine groups. Compared with BT resin, all hybrids show improved dielectric properties. Specifically, hybrids have slightly decreased dielectric constants and similar dependence of dielectric constant on frequency over the whole frequency from 10 to 10 6 Hz; more interestingly, the dielectric loss of hybrids is only 25% of that of BT resin at the frequency lower than 10 5 Hz, whereas all hybrids and BT resin have almost equal dielectric loss when the frequency is higher than 10 5 Hz. In addition, POSS‐NH 2 /BT hybrids also show good thermal and thermo‐oxidative stability compared with BT resin. All these differences in macroproperties are attributed to the difference in chemical structure between POSS‐NH 2 /BT hybrids and BT resin. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011